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wafer probing

См. также в других словарях:

  • Non-contact wafer testing — Wafer testing is a normal step in semiconductor device fabrication, used to detect defects in integrated circuits (IC) before they are assembled during the IC packaging step. Traditional (contact) wafer testing Probing ICs while they are still on …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Nasiri-Fabrication — Process The Nasiri Fabrication Process, patented by InvenSense, uses a wafer to wafer bonding process that allows for direct integration of the fabricated MEMS wafers to any off the shelf CMOS wafer at the wafer level. Although the wafer bonding… …   Wikipedia

  • Product engineering — refers to the process of designing and developing a device, assembly, or system such that it be produced as an item for sale through some production manufacturing process. Product engineering usually entails activity dealing with issues of cost,… …   Wikipedia

  • Multi-site test — Multi site test, or multisite test , or concurrent test , or parallel test are all semiconductor Automatic Test Equipment (ATE) terms that generally refer to testing of multiple devices at the same time. Currently, devices refer to System on a… …   Wikipedia

  • Galliumnitrid — Kristallstruktur Ga      N …   Deutsch Wikipedia

  • Neuroprosthetics — (also called neural prosthetics) is a discipline related to neuroscience and biomedical engineering concerned with developing neural prostheses. Neural prostheses are a series of devices that can substitute a motor, sensory or cognitive modality… …   Wikipedia

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